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TGA2618 Datasheet(PDF) 3 Page - TriQuint Semiconductor |
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TGA2618 Datasheet(HTML) 3 Page - TriQuint Semiconductor |
3 / 11 page TGA2618 16 - 18 GHz GaAs LNA Preliminary Datasheet: Rev - 09-09-14 - 3 of 11 - Disclaimer: Subject to change without notice © 2014 TriQuint www.triquint.com Thermal and Reliability Information Parameter Test Conditions Value Units Thermal Resistance ( θJC) (1) Tbase = 85 °C, VD = 3 V (CW) IDQ = 30 mA, PDISS = 0.09 W 96 ºC/W Channel Temperature (TCH) (Without RF) 94 °C Median Lifetime (TM) 1.3 x 10^9 Hrs Thermal Resistance ( θJC) (1) Tbase = 85 °C, VD = 3 V (CW) IDQ = 30 mA, ID_Drive = 50 mA PIN = -10 dBm, POUT = 10 dBm, Freq = 17 GHz, PDISS = 0.14 W 96 ºC/W Channel Temperature (TCH) (Under RF drive) 98 °C Median Lifetime (TM) 7.5 x 10^8 Hrs Notes: 1. Thermal resistance calculated at back of a 40 mil CuMo carrier plate with 1.5 mil of AuSn solder for die attach. Test Conditions: VD = 6 V; Failure Criteria is 10% reduction in ID_MAX 1E+03 1E+04 1E+05 1E+06 1E+07 1E+08 1E+09 1E+10 1E+11 1E+12 1E+13 1E+14 1E+15 25 50 75 100 125 150 175 200 Channel Temperature, T CH (°C) Median Lifetime vs. Channel Temperature FET5 |
Similar Part No. - TGA2618_15 |
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Similar Description - TGA2618_15 |
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