TGA2814-CP

3.1 to 3.6 GHz, 80W GaN Power Amplifier

Preliminary Datasheet: 09-18-14

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Disclaimer: Subject to change without notice

© 2014 TriQuint

www.triquint.com

Assembly Notes

1.

Clean the board or module with alcohol. Allow it to dry fully.

2.

Nylock screws are recommended for mounting the TGA2814-CP to the board.

3.

To improve the thermal and RF performance, we recommend the following:

a.

Apply thermal compound or 4 mils indium shim between the package and the board.

b.

Attach a heat sink to the bottom of the board and apply thermal compound or 4 mils indium shim

between the heat sink and the board.

4.

Apply solder to each pin of the TGA2814-CP.

5.

Clean the assembly with alcohol.

Mechanical Information

Units: inches

Tolerances: unless specified

x.xx = ± 0.01

x.xxx = ± 0.005

Materials:

Base: Copper

Lid:

Plastic

All metalized features are gold plated

Part is epoxy sealed

Marking:

2814: Part number

YY: Part Assembly year

WW: Part Assembly week

ZZZ: Serial Number

MXXX: Batch ID

6

7

8

9

10

5

4

3

2

1