6

TGA4043

May 2009 © Rev -

TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com

Mechanical Characteristics

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

0

0

0.126 (0.005)

0.955 (0.038)

2.672 (0.105)

1.876 (0.074)

3.140 (0.124)

1

23

4

5

6

7

8

9

10

11

12

Bond Pad #1 (RF Input)

Bond Pad #2 (Vg 1)

Bond Pad #3 (Vd 1)

Bond Pad #4 (Vg 1)

Bond Pad #5 (Vd 1)

Bond Pad #6 (Bypass)

Bond Pad #7 (RF Output)

Bond Pad #8 (Bypass)

Bond Pad #9 (Vd 2)

Bond Pad #10 (Vg 2)

Bond Pad #11 (Vd #2)

Bond Pad #12 (Vg #2)

Units: millimeters (inches)

Thickness: 0.100 (0.004) (reference only)

Chip edge to bond pad dimensions are shown to center of bond pad

Chip size tolerance: +/- 0.051 (0.002)

GND IS BACKSIDE OF MMIC

0.105 x 0.130 (0.004 x 0.005)

0.105 x 0.105 (0.004 x 0.004)

0.105 x 0.105 (0.004 x 0.004)

0.105 x 0.105 (0.004 x 0.004)

0.105 x 0.105 (0.004 x 0.004)

0.105 x 0.105 (0.004 x 0.004)

0.105 x 0.130 (0.004 x 0.005)

0.105 x 0.130 (0.004 x 0.005)

0.105 x 0.105 (0.004 x 0.004)

0.105 x 0.105 (0.004 x 0.004)

0.105 x 0.105 (0.004 x 0.004)

0.105 x 0.105 (0.004 x 0.004)