9

TGA4803

May 2009 © Rev -

Assembly Process Notes

Reflow process assembly notes:

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Use AuSn (80/20) solder with limited exposure to temperatures at or above 300

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An alloy station or conveyor furnace with reducing atmosphere should be used.

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No fluxes should be utilized.

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Coefficient of thermal expansion matching is critical for long-term reliability.

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Devices must be stored in a dry nitrogen atmosphere.

Component placement and adhesive attachment assembly notes:

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Vacuum pencils and/or vacuum collets are the preferred method of pick up.

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Air bridges must be avoided during placement.

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The force impact is critical during auto placement.

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Organic attachment can be used in low-power applications.

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Curing should be done in a convection oven; proper exhaust is a safety concern.

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Microwave or radiant curing should not be used because of differential heating.

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Coefficient of thermal expansion matching is critical.

Interconnect process assembly notes:

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Thermosonic ball bonding is the preferred interconnect technique.

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Force, time, and ultrasonics are critical parameters.

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Aluminum wire should not be used.

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Maximum stage temperature is 200

TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com