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TGA4906 Datasheet(PDF) 11 Page - TriQuint Semiconductor |
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TGA4906 Datasheet(HTML) 11 Page - TriQuint Semiconductor |
11 / 13 page TGA4906 TGA4906 TGA4906 TGA4906 Mechanical Drawing 0.00 2.90 1.45 0.10 2.80 1.45 0.11 2.79 1 2 3 4 5 6 7 8 9 10 11 Sept 2010 © Rev B TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. Units: millimeters Thickness: 0.05 Die x,y size tolerance: +/- 0.050 Chip edge to bond pad dimensions are shown to center of pad Ground is backside of die Bond Pad #1 RF In 0.125 x 0.200 Bond Pad #6 RF Out 0.125 x 0.200 Bond Pad #2 Vd_1 top 0.150 x 0.100 Bond Pad #7 Vd_3 bottom 0.225 x 0.125 Bond Pad #3 Vg_1,2,3 top 0.100 x 0.100 Bond Pad #8 Vd_2 bottom 0.225 x 0.125 Bond Pad #4 Vd_2 top 0.225 x 0.125 Bond Pad #9 Vg_1,2,3 bottom 0.100 x 0.100 Bond Pad #5 Vd_3 top 0.225 x 0.125 Bond Pad #10 Vd_1 bottom 0.150 x 0.100 |
Similar Part No. - TGA4906_15 |
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Similar Description - TGA4906_15 |
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