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TGA4928 Datasheet(PDF) 9 Page - TriQuint Semiconductor |
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TGA4928 Datasheet(HTML) 9 Page - TriQuint Semiconductor |
9 / 11 page TGA4928 High Linearity LNA Gain Block Datasheet: Rev - 06-19-14 - 9 of 11 - Disclaimer: Subject to change without notice © 2014 TriQuint www.triquint.com Mechanical Drawing Unit: millimeters Thickness: 0.085 Die x, y size tolerance: +/- 0.050 Chip edge to bond pad dimensions are shown to center of pad Ground is backside of die Bond Pad Symbol Pad Size (mm) Description 1 RF Input 0.150 x 0.100 RF Input matched to 50 Ohms, not DC blocked 2 (Opt.) Ext. Cap 0.075 x 0.075 Connect ext. cap to increase lower end bandwidth 3 (Opt.) Ext. Cap 0.075 x 0.075 Connect ext. cap to increase lower end bandwidth 4 RF Output/Bias 0.150 x 0.100 RF Output matched to 50 Ohms, not DC blocked, apply device bias |
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