TGP2615

15- to 19-GHz 6-Bit Digital Phase Shifter

Preliminary Datasheet: Rev - 07-11-14

- 6 of 9 -

Disclaimer: Subject to change without notice

© 2014 TriQuint

www.triquint.com

Mechanical Information and Bond Pad Description

Bond Pad

Symbol

Description

Pad Size

1

RF IN

RF Input;

50 Ω; DC-Blocked

0.100 x 0.200

2

5°

5° Bit Control

0.100 x 0.100

3

11°

11° Bit Control

0.100 x 0.100

4

180°

180° Bit Control

0.100 x 0.100

5

45°

45° Bit Control

0.100 x 0.100

6

90°

90° Bit Control

0.100 x 0.100

7

22°

22° Bit Control

0.100 x 0.100

8

Reference voltage for logic “1”

0.100 x 0.100

9

RF OUT

RF Output;

50 Ω; DC-Blocked

0.100 x 0.200

10

180°

180° Bit Alternate Control

0.100 x 0.100

11

11°

11° Bit Alternate Control

0.100 x 0.100

12

5°

5° Bit Alternate Control

0.100 x 0.100

Unit: millimeters

Thickness: 0.10

Die x,y size tolerance: ± 0.050

Chip edge to bond pad dimensions are shown to center of pad

Ground is backside of die