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MAGX-001214-250L00 Datasheet(PDF) 2 Page - M/A-COM Technology Solutions, Inc.

Part # MAGX-001214-250L00
Description  GaN on SiC HEMT Pulsed Power Transistor
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Manufacturer  MA-COM [M/A-COM Technology Solutions, Inc.]
Direct Link  http://www.macomtech.com
Logo MA-COM - M/A-COM Technology Solutions, Inc.

MAGX-001214-250L00 Datasheet(HTML) 2 Page - M/A-COM Technology Solutions, Inc.

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GaN on SiC HEMT Pulsed Power Transistor
250W Peak, 1200-1400 MHz, 300µs Pulse, 10% Duty
MAGX-001214-250L00
Production V1
18 Aug 11
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology
Solutions is considering for development. Performance is based on target specifications, simu-
lated results, and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be avail-
able. Commitment to produce in volume is not guaranteed.
Absolute Maximum Ratings Table (1, 2, 3)
Supply Voltage (VDD)
+65V
Supply Voltage (VGS)
-8 to -2V
Supply Current (IDMAX)
8.8 Apk
Input Power (PIN)
+40 dBm
Absolute Max. Junction/Channel Temp
200 ºC
MTTF (TJ<200°C)
114 years
Pulsed Power Dissipation at 85ºC
192 Wpk
Thermal Resistance, (Tj = 70 ºC)
VDD = 50V, IDQ = 250mA, Pout = 250W
300us Pulse / 10% Duty
0.60ºC/W
Operating Temp
-40 to +95ºC
Storage Temp
-65 to +150ºC
Mounting Temperature
See solder reflow profile
ESD Min. - Machine Model (MM)
50V
ESD Min. - Human Body Model (HBM)
>250V
MSL Level
MSL1
(1) Operation of this device above any one of these parameters may cause permanent damage.
(2) Channel temperature directly affects a device's MTTF. Channel temperature should be kept as low as
possible to maximize lifetime.
(3) For saturated performance it recommended that the sum of (3*Vdd + abs(Vgg)) <175
Parameter
Test Conditions
Symbol
Min
Typ
Max
Units
DC CHARACTERISTICS
Drain-Source Leakage Current
VGS = -8V, VDS = 175V
IDS
-
0.4
12
mA
Gate Threshold Voltage
VDS = 5V, ID = 30mA
VGS (th)
-5
-3.1
-2
V
Forward Transconductance
VDS = 5V, ID = 7.0mA
GM
5.0
7.7
-
S
DYNAMIC CHARACTERISTICS
Input Capacitance
Not applicable—Input internally matched
CISS
N/A
N/A
N/A
pF
Output Capacitance
VDS = 50V, VGS = -8V, F = 1MHz
COSS
-
22
-
pF
Feedback Capacitance
VDS = 50V, VGS = -8V, F = 1MHz
CRSS
-
2.2
-
pF


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