TGV2566-SM

13.4

– 14.4 GHz VCO with Divide by 2

Preliminary Datasheet: Rev- 05-30-13

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Disclaimer: Subject to change without notice

© 2013 TriQuint

www.triquint.com

Mechanical Information

PCB Mounting Pattern

All dimensions are in millimeters [inches].

Notes:

1.The pad pattern shown has been developed and tested for optimized assembly at TriQuint Semiconductor. The

PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount

processes vary from company to company, careful process development is recommended.

2.Ground / thermal vias are critical for the proper performance of this device. Vias have a final plated thru diameter

of .25 mm (.010”).