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PC1458 Datasheet(PDF) 10 Page - Renesas Technology Corp |
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PC1458 Datasheet(HTML) 10 Page - Renesas Technology Corp |
10 / 11 page Data Sheet G12195EJ6V0DS 8 µPC1458 RECOMMENDED SOLDERING CONDITIONS The µPC1458 should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) TYPES OF SURFACE MOUNT DEVICE µPC1458G2: 8-pin plastic SOP (5.72 mm (225)) Process Conditions Symbol Infrared Ray Reflow Peak temperature: 230°C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210°C or higher), Maximum number of reflow processes: 1 time. IR30-00-1 Vapor Phase Soldering Peak temperature: 215°C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200°C or higher), Maximum number of reflow processes: 1 time. VP15-00-1 Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120°C or below (Package surface temperature). WS60-00-1 Partial Heating Method Pin temperature: 300°C or below, Heat time: 3 seconds or less (Per each side of the device). – Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. TYPES OF THROUGH HOLE DEVICE µPC1458C: 8-pin plastic DIP (7.62 mm (300)) Soldering method Soldering conditions Recommended condition symbol Wave soldering Solder temperature: 260°C or below, Flow time: 10 seconds or below |
Similar Part No. - PC1458_15 |
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Similar Description - PC1458_15 |
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