Packing specifications and labelling description

TN1163

10/21

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Packing specifications and labelling description

WLCSP devices are delivered in tape and reel to be fully compatible with standard high

volume SMD components. All tape and reel characteristics are compliant with EIA-481-C

and IEC 60286-3 standards and EIA 763 (783).

3.1

Carrier tape

The WLCSP are placed in carrier tapes with their ball side facing the bottom of the cavity so

that the devices can be picked up by their flat side. No flipping of the package is required for

mounting on the PCB. The devices are positioned in the carrier tape with pin A1 on the

sprocket hole side.

An example of carrier tape mechanical dimensions is shown in Figure 4. The standard tape

width is 8 mm for die size smaller than 3 mm (dimension B0).

Note:

12 mm carrier tape width may be used for larger die size to be in line with EIA standards.

Figure 4. Typical tape dimensions for WLCSPs

The cavities in the carrier tape have been designed to avoid damaging the components. No

hole is present in the cavity to avoid any impact or any external contamination of the solder

bumps. Refer to Table 3 for the cavity dimension according to the die size.

The embossed carrier tape is in a black conductive material (surface resistivity within 10E4

and 10E8

electrostatic discharge and ensures the total discharge of the component prior to the

placement on the PCB. Conductivity is guaranteed to be constant and is not affected by

shelf life or humidity. The material does not break when bent and does not have any powder

or flake residue that rubs off.