LT1187

4

LT1187C

SYMBOL

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Input Offset Voltage

Either Input, (Note 4)

2.0

12

mV

9.0

µV/°C

Input Offset Current

Either Input

0.2

1.5

µA

Input Bias Current

Either Input

±0.5

±3.5

µA

Input Voltage Range

– 2.5

3.5

V

CMRR

Common-Mode Rejection Ratio

70

100

dB

PSRR

Power Supply Rejection Ratio

65

85

dB

Output Voltage Swing

±3.7

±4.0

V

±6.6

±7.0

±6.4

±6.8

Gain Error

0.2

1.0

%

Supply Current

13

17

mA

Shutdown Supply Current

0.8

1.5

mA

Shutdown Pin Current

525

µA

LT1187C

SYMBOL

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Input Offset Voltage

Either Input, (Note 4)

2.0

12.0

mV

SOIC Package

2.0

13.0

mV

9.0

µV/°C

Input Offset Current

Either Input

0.2

1.5

µA

Input Bias Current

Either Input

±0.5

±3.5

µA

Input Voltage Range

2.0

3.5

V

CMRR

Common-Mode Rejection Ratio

70

100

dB

Output Voltage Swing

3.5

4.0

V

(Note 3)

0.15

0.4

Supply Current

12

16

mA

Shutdown Supply Current

Pin 5 at V

0.8

1.5

mA

Shutdown Pin Current

Pin 5 at V

–

525

µA

5V

S

Note 1: A heat sink may be required to keep the junction temperature below

absolute maximum when the output is shorted continuously.

LT1187MJ8,LT1187CJ8:

LT1187CN8:

LT1187CS8:

pair, and is input referred.

pin 3) for which the output can respond.

Note 6: Slew rate is measured between

of

Note 7: Full power bandwidth is calculated from the slew rate measurement:

FPBW = SR/2

πVp.

Note 8: Settling time measurement techniques are shown in “Take the

Guesswork Out of Settling Time Measurements,” EDN, September 19, 1985.

Note 9: NTSC (3.58MHz).

Note 10: AC parameters are 100% tested on the ceramic and plastic DIP

packaged parts (J8 and N8 suffix) and are sample tested on every lot of the SO

packaged parts (S8 suffix).

Note 11: See Application section for shutdown at elevated temperatures. Do

5V

–

+

ELECTRICAL C

C

ELECTRICAL C

C