9

µPD77015, 77017, 77018

CONTENTS

1.

PIN FUNCTIONS ............................................................................................................................... 10

1.1

Pin Functions ........................................................................................................................................... 10

1.2

Recommended Connection for Unused Pins ....................................................................................... 15

2.

FUNCTIONS ...................................................................................................................................... 16

2.1

Pipeline Processing ................................................................................................................................ 16

2.1.1

Outline ........................................................................................................................................... 16

2.1.2

Instructions with Delay .................................................................................................................. 16

2.2

Program Control Unit .............................................................................................................................. 17

2.3

Operation Unit ......................................................................................................................................... 17

2.3.1

General register (R0 to R7) ........................................................................................................... 17

2.3.2

MAC: Multiply ACcumulator ......................................................................................................... 18

2.3.3

ALU: Arithmetic Logic Unit ........................................................................................................... 18

2.3.4

BSFT: Barrel ShiFTer ................................................................................................................... 18

2.3.5

SAC: Shifter And Count Circuit .................................................................................................... 18

2.3.6

CJC: Condition Judge Circuit ....................................................................................................... 19

2.4

Memory ..................................................................................................................................................... 19

2.4.1

Instruction RAM Outline ................................................................................................................ 20

2.4.2

Data Memory Outline .................................................................................................................... 21

2.4.3

Data Memory Addressing .............................................................................................................. 22

2.5

On-chip Peripheral Circuit ...................................................................................................................... 22

2.5.1

Serial Interface Outline .................................................................................................................. 22

2.5.2

Host Interface Outline .................................................................................................................... 22

2.5.3

General Input/output Ports Outline ................................................................................................ 22

2.5.4

Wait Cycle Register ....................................................................................................................... 22

3.

INSTRUCTIONS ................................................................................................................................ 23

3.1

Outline ...................................................................................................................................................... 23

3.2

Instruction Set and Operation ................................................................................................................ 24

4.

ELECTRICAL SPECIFICATIONS ..................................................................................................... 32

5.

PACKAGE DRAWING ...................................................................................................................... 53

6.

RECOMMENDED SOLDERING CONDITIONS ................................................................................ 54