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V120MLA1210 Datasheet(PDF) 8 Page - Littelfuse |
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V120MLA1210 Datasheet(HTML) 8 Page - Littelfuse |
8 / 11 page Soldering Recommendations The principal techniques used for the soldering of components in surface mount technology are Infrared (IR) re-flow, vapour phase re-flow and wave soldering. Typical profiles are shown in Figures 14, 15 and 16. When wave soldering, the ML suppressor is attached to the circuit board by means of an adhesive. The assembly is then placed on a conveyor and run through the soldering process to contact the wave. With IR and vapour phase reflow; the device is placed in a solder paste on the substrate. As the solder paste is heated, it re-flows and solders the unit to the board. The recommended solder for the ML suppressor is a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also recommends an RMA solder flux. Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. For 0402 size devices, IR re-flow is recommended. When using a reflow process, care should be taken to ensure that the ML chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. During the soldering process, preheating to within 100 degrees of the solder’s peak temperature is essential to minimize thermal shock. Examples of the soldering conditions for the ML suppressor are given in the tables below. Once the soldering process has been completed, it is still necessary to ensure that any further thermal shocks are avoided. One possible cause of thermal shock is hot printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. The boards must be allowed to cool gradually to less than 50oC before cleaning. Termination Options Littelfuse offers three types of electrode termination finish for the Multilayer product series: 1. Silver/Platinum (standard, not available for 0402) 2. Silver/Palladium (optional) (The ordering information section describes how to designate them.) FIGURE 14. REFLOW SOLDER PROFILE FIGURE 15. WAVE SOLDER PROFILE FIGURE 16. VAPOR PHASE SOLDER PROFILE TIME (MINUTES) 300 250 200 150 100 50 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 MAXIMUM WAVE 260 oC SECOND PREHEAT FIRST PREHEAT TIME (MINUTES) 250 200 150 100 50 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 RAMP RATE PREHEAT ZONE >50oC/s MAXIMUM TEMPERATURE 222oC 40-80 SECONDS ABOVE 183 oC TIME (MINUTES) 250 200 150 100 50 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 MAXIMUM PREHEAT DWELL PREHEAT ZONE TEMPERATURE 222oC RAMP RATE <2oC/s 40-80 SECONDS ABOVE 183 oC ML Varistor Series Surface Mount Varistors Multilayer Transient Voltage Surge Suppressors 147 www .littelfuse .com 3 3. Nickel Barrier (optional for 0402-1210 package size) (The ordering information section describes how to designate them.) Next Previous |
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