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RFFM4200SB Datasheet(PDF) 7 Page - RF Micro Devices |
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RFFM4200SB Datasheet(HTML) 7 Page - RF Micro Devices |
7 / 15 page 7 of 15 RFFM4200 DS121008 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com. Package Drawing Note: Thermal vias for center slug “B” should be incorporated into the PCB design. The number and size of thermal vias will depend on the application. Example of the number and size of vias can be found on the RFMD evaluation board layout. PCB METAL LAND PATTERN 0.000 2x 0.900 2x 1.800 7x 2.700 2x 0.900 2x 1.800 7x 2.700 A = 0.400 x 0.400 mm B = 4.400 x 4.400 mm A A A A A A A A A A A A A B A A A A A A A A A A A 20x 0.300 PCB STENCIL PATTERN A A A A A A A A A A A A A B A A A A A A A A A A A 7x 2.700 2x 1.800 2x 0.900 0.000 2x 0.900 2x 1.800 7x 2.700 3x 1.550 3x 1.550 A = 0.360 x 0360 mm B = 1.170 x 1.179 mm 20x 0.385 B B B B B B B B Notes Notes: 1. Shaded area represents Pin 1 location 1. Shaded area represents Pin 1 location PCB SOLDER MASK PATTERN A A A A A A A A A A A A A B A A A A AA A A A A A A = 0.550 x 0.550 mm B = 4.550 x 4.550 mm 0.000 2x 0.900 2x 1.800 7x 2.700 2x 0.900 2x 1.800 7x 2.700 20x 0.150 |
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