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DS111011

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

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SGA2363Z

SOT-363 PCB Pad Layout

SOT-363 Nominal Package Dimensions

Pin

Function

Description

3RF IN

RF input pin. This pin requires the use of an external DC blocking capacitor chosen for the frequency of operation.

1, 2,

4, 5

GND

Connection to ground. Use via holes for best performance to reduce lead inductance as close to ground leads as possi-

ble.

ation.

Preliminary

SOT-363 PCB Pad Layout

Dimensions in inches [millimeters]

RF

OUT

RF

I N

Notes:

1. Provide a large ground pad area under device

pins 1, 2, 4, & 5 with many plated via holes as

shown.

2. Dimensions given for 50 Ohm RF I/O lines are for

31 mil thick Getek. Scale accordingly for different

board thicknesses and dielectric contants.

3. We recommend 1 or 2 ounce copper. Measure-

ments for this data sheet were made on a 31 mil

thick Getek with 1 ounce copper on both sides.