PEMB11_PUMB11

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© NXP B.V. 2011. All rights reserved.

Product data sheet

Rev. 3 — 30 November 2011

4 of 14

NXP Semiconductors

PEMB11; PUMB11

PNP/PNP resistor-equipped transistors; R1 = 10 k

, R2 = 10 k

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

Reflow soldering is the only recommended soldering method.

FR4 PCB, standard footprint

Fig 1.

Per device: Power derating curve for SOT363 (SC-88) and SOT666

-75

175

125

25

75

-25

006aac749

200

100

300

400

(mW)

0

Table 7.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Per transistor

thermal resistance from

junction to ambient

in free air

[1]

PEMB11 (SOT666)

[2] --625

K/W

PUMB11 (SOT363)

-

-

625

K/W

Per device

thermal resistance from

junction to ambient

in free air

[1]

PEMB11 (SOT666)

[2] --417

K/W

PUMB11 (SOT363)

-

-

417

K/W