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NCP502 Datasheet(PDF) 2 Page - ON Semiconductor |
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NCP502 Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 9 page NCP502, NCV502 http://onsemi.com 2 PIN FUNCTION DESCRIPTION Pin No. Pin Name Description 1 Vin Positive power supply input voltage. 2 GND Power supply ground. 3 Enable This input is used to place the device into low−power standby. When this input is pulled low, the device is disabled. If this function is not used, Enable should be connected to Vin. 4 N/C No internal connection. 5 Vout Regulated output voltage. MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage Vin 12 V Enable Voltage Enable −0.3 to Vin +0.3 V Output Voltage Vout −0.3 to Vin +0.3 V Power Dissipation and Thermal Characteristics Power Dissipation PD Internally Limited W Operating Junction Temperature TJ +150 C Operating Ambient Temperature NCP502 NCV502 TA −40 to +85 −40 to +125 C Storage Temperature Tstg −55 to +150 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Latchup capability (85C) 100 mA DC with trigger voltage. THERMAL CHARACTERISTICS Rating Symbol Test Conditions Value Unit Thermal Characteristics, TSOP−5 (Note 2) Thermal Resistance, Junction−to−Air (Note 3) RqJA 1 oz Copper Thickness, 100 mm2 205 C/W Thermal Resistance, Junction−to−Ambient, SC70−5 RqJA 400 W C/W NOTE: Single component mounted on a 80 x 80 x 15 mm FR4 PCB with stated copper head spreading area. Using the following boundary conditions as stated in EIA/JESD 51−1, 2, 3, 7, 12. 2. True no connect. Printed circuit board traces are allowable. 3. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL−STD−883, Method 3015. Machine Model Method 200 V.. |
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