NXP Semiconductors

BAT754L

Schottky barrier triple diode

BAT754L

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Product data sheet

22 November 2012

5 / 9

9. Package outline

06-03-16

Dimensions in mm

0.25

0.10

0.3

0.2

pin 1

index

1.3

0.65

2.2

2.0

1.35

1.15

2.2

1.8

1.1

0.8

0.45

0.15

1

3

2

4

6

5

Fig. 4. Package outline TSSOP6 (SOT363)

10. Soldering

solder lands

solder resist

occupied area

solder paste

sot363_fr

2.65

2.35

0.4 (2×)

0.6

(2×)

0.5

(4×)

0.5

(4×)

0.6

(4×)

0.6

(4×)

1.5

1.8

Dimensions in mm

Fig. 5. Reflow soldering footprint for TSSOP6 (SOT363)