Low-Voltage SIM/Smart Card

Level Translators in µMAX

2

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ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

RIN, CIN, DATA, DDRV,

10-Pin µMAX (derate 5.6mW/°C above +70°C) ...........444mW

Operating Temperature Range ...........................-40°C to +85°C

Storage Temperature Range .............................-65°C to +150°C

Junction Temperature ......................................................+150°C

Lead Temperature (soldering, 10s) .................................+300°C

UNITS

1.4

5.5

V

1.7

5.5

V

CIN static

0.1

0.5

µA

with 50% duty cycle

CONDITIONS

2.5

with 50% duty cycle

5

CIN static

0.9

3.0

mA

with 50% duty cycle

0.4

with 50% duty cycle

0.8

Total Shutdown Current

0.01

1

µA

Digital Input Low Threshold

0.2

V

Digital Input High Threshold

0.7

V

Input Leakage Current

0.01

1

µA

Digital Output Low Level

0.4

V

Digital Output High Level

0.9

V

0.8

DATA Pullup Resistance

13

20

28

k

Ω

Input Low Threshold

(Note 2)

0.3

V

Input High Threshold

(Note 3)

V

Input Low Current

1

mA

MIN

TYP

MAX

SYMBOL

PARAMETER

Input High Current

2

µA

POWER SUPPLIES

CIN, RIN, SHDN, DDRV LOGIC INPUTS

CLK, RST OUTPUTS

DATA INPUT/OUTPUT

µA