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MAX199BMYI Datasheet(PDF) 7 Page - Maxim Integrated Products

Part # MAX199BMYI
Description  Multi-Range (짹4V, 짹2V, 4V, 2V), 5V Supply, 12-Bit DAS with 84 Bus Interface
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX199BMYI Datasheet(HTML) 7 Page - Maxim Integrated Products

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Multi-Range (±4V, ±2V, +4V, +2V),
+5V Supply, 12-Bit DAS with 8+4 Bus Interface
_______________________________________________________________________________________
7
______________________________________________________________Pin Description
Digital Ground
DGND
28
+5V Supply. Bypass with 0.1µF capacitor to AGND.
VDD
27
INT goes low when conversion is complete and output data is ready.
INT
24
Bandgap Voltage-Reference Output / External Adjust Pin. Bypass with a 0.01µF capacitor to AGND.
Connect to VDD when using an external reference at the REF pin.
REFADJ
25
Reference Buffer Output / ADC Reference Input. In internal reference mode, the reference buffer provides a
4.096V nominal output, externally adjustable at REFADJ. In external reference mode, disable the internal
buffer by pulling REFADJ to VDD.
REF
26
Three-State Digital I/O. D2 output (HBEN = low), D10 output (HBEN = high).
D2/D10
12
Three-State Digital I/O. D1 output (HBEN = low), D9 output (HBEN = high).
D1/D9
13
Three-State Digital I/O. D0 output (HBEN = low), D8 output (HBEN = high). D0 = LSB.
D0/D8
14
Analog Ground
AGND
15
Analog Input Channels
CH0–CH7
16–23
Used to multiplex the 12-bit conversion result. When high, the 4 MSBs are multiplexed on the data bus;
when low, the 8 LSBs are available on the bus.
HBEN
5
Shutdown. Puts the device into full power-down (FULLPD) mode when pulled low.
SHDN
6
Three-State Digital I/O
D7–D4
7–10
Three-State Digital I/O. D3 output (HBEN = low), D11 output (HBEN = high).
D3/D11
11
When CS is low, a falling edge on RD will enable a read operation on the data bus.
RD
4
When CS is low, in the internal acquisition mode, a rising edge on WR latches in configuration data and starts an
acquisition plus a conversion cycle. When CS is low, in the external acquisition mode, the first rising edge on
WR starts an acquisition and a second rising edge on WR ends acquisition and starts a conversion cycle.
WR
3
PIN
Chip Select, active low.
CS
2
Clock Input. In external clock mode, drive CLK with a TTL/CMOS compatible clock. In internal clock mode,
place a capacitor (CCLK) from this pin to ground to set the internal clock frequency; fCLK = 1.56MHz typical
with CCLK = 100pF.
CLK
1
FUNCTION
NAME
100k
510k
24k
REFADJ
+5V
0.01
µF
MAX199
Figure 1. Reference-Adjust Circuit
3k
3k
DOUT
DOUT
+5V
a) High-Z to VOH and VOL to VOH
b) High-Z to VOL and VOH to VOL
CLOAD
CLOAD
Figure 2. Load Circuits for Enable Time


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