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MAX3203EETT Datasheet(PDF) 6 Page - Maxim Integrated Products |
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MAX3203EETT Datasheet(HTML) 6 Page - Maxim Integrated Products |
6 / 15 page IEC 61000-4-2 The IEC 61000-4-2 standard covers ESD testing and performance of finished equipment. The MAX3202E/ MAX3203E/MAX3204E/MAX3206E help users design equipment that meets Level 4 of IEC 61000-4-2. The main difference between tests done using the Human Body Model and IEC 61000-4-2 is higher peak current in IEC 61000-4-2. Because series resistance is lower in the IEC 61000-4-2 ESD test model (Figure 6) the ESD-withstand voltage measured to this standard is generally lower than that measured using the Human Body Model. Figure 3 shows the current waveform for the ±8kV IEC 61000-4-2 Level 4 ESD Contact Discharge test. The Air-Gap Discharge test involves approaching the device with a charged probe. The Contact Discharge method connects the probe to the device before the probe is energized. Layout Recommendations Proper circuit-board layout is critical to suppress ESD- induced line transients. The MAX3202E/MAX3203E/ MAX3204E/MAX3206E clamp to 100V; however, with improper layout, the voltage spike at the device is much higher. A lead inductance of 10nH with a 45A current spike at a dv/dt of 1ns results in an ADDITION- AL 450V spike on the protected line. It is essential that the layout of the PC board follows these guidelines: 1) Minimize trace length between the connector or input terminal, I/O_, and the protected signal line. 2) Use separate planes for power and ground to reduce parasitic inductance and to reduce the impedance to the power rails for shunted ESD current. 3) Ensure short ESD transient return paths to GND and VCC. 4) Minimize conductive power and ground loops. 5) Do not place critical signals near the edge of the PC board. 6) Bypass VCC to GND with a low-ESR ceramic capac- itor as close to VCC as possible. 7) Bypass the supply of the protected device to GND with a low-ESR ceramic capacitor as close to the supply pin as possible. UCSP Considerations For general UCSP package information and PC layout considerations, refer to Maxim Application Note 263, Wafer-Level Chip-Scale Package. ___________________UCSP Reliability The UCSP represents a unique packaging form factor that may not perform equally to a packaged product through traditional mechanical reliability tests. UCSP reliability is integrally linked to the user’s assembly meth- ods, circuit-board material, and usage environment. The user should closely review these areas when con- sidering use of a UCSP. Performance through operat- ing life test and moisture resistance remains uncompromised as it is primarily determined by the wafer-fabrication process. Mechanical stress perfor- mance is a greater consideration for a UCSP. UCSPs are attached through direct solder contact to the user’s PC board, foregoing the inherent stress relief of a pack- aged product lead frame. Solder-joint contact integrity must be considered. Table 1 shows the testing done to characterize the UCSP reliability performance. In con- clusion, the UCSP is capable of performing reliably through environmental stresses as indicated by the results in the table. Additional usage data and recom- mendations are detailed in the UCSP application note, which can be found on Maxim’s website at www.maxim-ic.com. Chip Information DIODE COUNT: MAX3202E: 4 MAX3203E: 6 MAX3204E: 8 MAX3206E: 12 PROCESS: BiCMOS Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD Protection Arrays for High-Speed Data Interfaces 6 _______________________________________________________________________________________ CHARGE-CURRENT- LIMIT RESISTOR DISCHARGE RESISTANCE STORAGE CAPACITOR Cs 150pF RC 50Ω to 100Ω RD 330Ω HIGH- VOLTAGE DC SOURCE DEVICE UNDER TEST Figure 6. IEC 61000-4-2 ESD Test Model |
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