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MAX3935EGJ Datasheet(PDF) 11 Page - Maxim Integrated Products |
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MAX3935EGJ Datasheet(HTML) 11 Page - Maxim Integrated Products |
11 / 14 page 10.7Gbps EAM Driver ______________________________________________________________________________________ 11 17 18 19 20 21 22 23 VEE GND MODN2 MOD MODN1 GND VEE 8 7 6 5 4 3 2 VTT CLK- CLK+ VTT VTT DATA- DATA+ MAX3935 1 VTT 24 N.C. TOP VIEW THE EXPOSED PAD MUST BE SOLDERED TO SUPPLY GROUND ON THE CIRCUIT BOARD. Pin Configuration Chip Topography The origin for pad coordinates is the center of the die. All pad locations are referenced from the origin and indicate the center of the pad where the bond wire should be connected. For more information on bonding coordinates refer to Maxim Application Note HFAN- 08.0.1: Understanding Bonding Coordinates and Physical Die Size on Maxim’s website. Chip Information TRANSISTOR COUNT: 1535 SUBSTRATE: INSULATOR, CONNECT TO GND PROCESS: SiGe BIPOLAR DIE THICKNESS: 8 mils Chip Topography VTT CLK- CLK+ VTT VTT DATA- DATA+ VTT VEE GND MODN1 MOD1 MOD2 MODN2 GND VEE GND N.C. MODSET MODMON VEE VEE GND GND VEE VEE GND N.C. N.C. PWC- PWC+ N.C. N.C. GND BIAS BIASSET BIASMON VEE VEE GND GND VEE VEE VCC MODEN RTEN N.C. N.C. |
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