BAT

CHG

OUT

IN

ISET

GND

TS

10 -pin 2mm x 3mm DFN

3

4

5

2

1

8

7

6

9

10

EN

LDO

GND

bq25071

www.ti.com

SLUSBK6 – JULY 2014

6 Device Comparison Table

PART NUMBER

bq25071DQCR

3.7 V

3.5 V

10.5 V

4.9 V

bq25071DQCT

3.7 V

3.5 V

10.5 V

4.9 V

7 Pin Configuration and Functions

bq25071

(TOP VIEW)

Pin Functions

PIN

I/O

DESCRIPTION

NAME

NO.

Input power supply. IN is connected to the external DC supply (AC adapter or USB port). Bypass IN to GND

IN

1

I

with at least a 0.1

μF ceramic capacitor.

Input current programming bias pin. Connect a resistor from ISET to GND to program the input current limit

ISET

2

O

when the user programmable mode is selected by grounding the EN pin. The resistor range is between 1 k

Ω

and 10 k

Ω to set the current between 100 mA and 1 A.

GND

3, 9

–

Ground pin. Connect to the thermal pad and the ground plane of the circuit.

LDO output. LDO is regulated to 4.9V and drives up to 50 mA. Bypass LDO to GND with a 0.1

μF ceramic

LDO

4

O

Battery pack NTC monitoring input. Connect a resistor divider from LDO to GND with TS connected to the

center tap to set the charge temperature window. The battery pack NTC is connected in parallel with the

TS

5

I

bottom resistor of the divider. See the Detailed Design Procedure section for details on the selecting the

proper component values.

BAT

6

I

BAT is the sense input for the battery voltage. Connect BAT and OUT to the battery.

Enable input. Drive EN high to disable the IC. Connect EN to GND to place the bq25071 in the user

programmable mode using the ISET input where the input current is programmed. Leave EN floating to place

EN

7

I

the bq25071 in USB500 mode. See the Input Current Limit Control (EN) section for details on using the EN

interface.

Charge status indicator open-drain output. CHG is pulled low while the device is charging the battery. CHG

CHG

8

O

goes high impedance when the battery is fully charged.

System output connection. Bypass the OUT to GND with a 1

μF ceramic capacitor. Connect OUT and BAT

OUT

10

O

together.

There is an internal electrical connection between the exposed thermal pad and the GND pin of the device.

Thermal

The thermal pad must be connected to the same potential as the GND pin on the printed circuit board. Do not

Pad

–

Pad

use the thermal pad as the primary ground input for the device. GND pin must be connected to ground at all

times.

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