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OPA627TDB1 Datasheet(PDF) 2 Page - Texas Instruments |
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OPA627TDB1 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 6 page OPA627-DIE SBOS717 – JULY 2014 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 4 Bare Die Information BACKSIDE BOND PAD BOND PAD DIE THICKNESS BACKSIDE FINISH POTENTIAL METALLIZATION COMPOSITION THICKNESS 10.5 mils Silicon with backgrind Floating AlSi (1%) 1100 nm 2 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated |
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