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TPS717 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS717 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 42 page TPS717 SBVS068H – FEBRUARY 2006 – REVISED JANUARY 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating temperature range (unless otherwise noted), all voltages are with respect to GND (1) MIN MAX UNIT VIN –0.3 7 V VFB –0.3 3.6 V Voltage VNR –0.3 3.6 V VEN –0.3 VIN + 0.3 V (2) V VOUT –0.3 7 V Current IOUT Internally limited A Continuous total power dissipation PDISS See Thermal Information Operating junction temperature TJ –55 150 °C Storage temperature Tstg –55 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) VEN absolute maximum rating is VIN + 0.3 V or 7 V, whichever is greater. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all ±2000 pins(1) V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22- ±500 C101, all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating junction temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input voltage 2.5 6.5 V VOUT Output voltage 0.9 5 V IOUT Output current 0 150 mA VEN Enable voltage 0 VIN V COUT Output capacitor 1 100 µF TJ Junction temperature –40 125 °C 6.4 Thermal Information TPS717xx THERMAL METRIC(1) DCK DRV DSE UNIT 5 PINS 6 PINS 6 PINS RθJA Junction-to-ambient thermal resistance 279.2 71.1 190.5 RθJC(top) Junction-to-case (top) thermal resistance 57.5 96.5 94.9 RθJB Junction-to-board thermal resistance 74.1 40.5 149.3 °C/W ψJT Junction-to-top characterization parameter 0.8 2.7 6.4 ψJB Junction-to-board characterization parameter 73.1 40.9 152.8 RθJC(bot) Junction-to-case (bottom) thermal resistance n/a 10.7 n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: TPS717 |
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