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BUK7C08-55AITE Datasheet(PDF) 5 Page - NXP Semiconductors |
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BUK7C08-55AITE Datasheet(HTML) 5 Page - NXP Semiconductors |
5 / 15 page BUK7C08-55AITE_2 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 — 17 February 2009 5 of 15 NXP Semiconductors BUK7C08-55AITE N-channel TrenchPLUS standard level FET 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-a) thermal resistance from junction to ambient mounted on printed-circuit board; minimum footprint --50 K/W Rth(j-mb) thermal resistance from junction to mounting base see Figure 4 - - 0.55 K/W Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration 03ni29 tp (s) 10−6 110 10−1 10−2 10−5 10−3 10−4 10−1 10−2 1 Zth(j-mb) (K/W) 10−3 single shot 0.2 0.1 0.05 0.02 δ = 0.5 tp tp T P t T δ = |
Similar Part No. - BUK7C08-55AITE_15 |
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