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TAS5424C-Q1 Datasheet(PDF) 8 Page - Texas Instruments |
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TAS5424C-Q1 Datasheet(HTML) 8 Page - Texas Instruments |
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8 / 51 page  TAS5414C-Q1, TAS5424C-Q1 SLOS795E – SEPTEMBER 2013 – REVISED JANUARY 2015 www.ti.com 6.3 Recommended Operating Conditions (1) MIN TYP MAX UNIT PVDDOP DC supply voltage range relative to GND 6 14.4 24 V VAIN_5414 (2) Analog audio input signal level (TAS5414C-Q1) AC-coupled input voltage 0 0.25–1(3) Vrms Analog audio input signal level (TAS5424C-Q1) AC-coupled input voltage 0 Vrms VAIN_5424 (2) 0.5–2(3) TA Ambient temperature –40 105 °C An adequate heat sink is required TJ Junction temperature –40 115 °C to keep TJ within specified range. RL Nominal speaker load impedance 2 4 Ω VPU Pullup voltage supply (for open-drain logic outputs) 3 3.3 or 5 5.5 V Resistor connected between open- RPU_EXT External pullup resistor on open-drain logic outputs 10 50 k Ω drain logic output and VPU supply RPU_I2C 1 4.7 10 k Ω I2C pullup resistance on SDA and SCL pins Total resistance of voltage divider for I2C address RI2C_ADD 10 50 k Ω slave 1 or slave 2, connected between D_BYP and GND pins RREXT External resistance on REXT pin 1% tolerance required 19.8 20 20.2 k Ω CD_BYP , External capacitance on D_BYP and A_BYP pins 10 120 nF CA_BYP COUT External capacitance to GND on OUT_X pins 150 680 nF External capacitance to analog input pin in series CIN 0.47 μF with input signal CFLY Flying capacitor on charge pump 0.47 1 1.5 μF CP Charge pump capacitor 50V needed for Load Dump 0.47 1 1.5 μF CMUTE MUTE pin capacitor 100 220 1000 nF COSCSYNC_MAX Allowed loading capacitance on OSC_SYNC pin 75 pF (1) The Recommended Operating Conditions table specifies only that the device is functional in the given range. See the Electrical Characteristics table for specified performance limits. (2) Signal input for full unclipped output with gains of 32 dB, 26 dB, 20 dB, and 12 dB (3) Maximum recommended input voltage is determined by the gain setting. 6.4 Thermal Information PARAMETER VALUE (Typical) UNIT Junction-to-case (heat slug) thermal RθJC 1 resistance, DKE package Junction-to-case (heat slug) thermal RθJC 1.2 °C/W resistance, PHD package This device is not intended to be used without a heatsink. Therefore, RθJA RθJA Junction-to-ambient thermal resistance is not specified. Refer to the Thermal Information section. Exposed pad dimensions, DKE package 13.8 × 5.8 mm Exposed pad dimensions, PHD package 8 × 8 8 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: TAS5414C-Q1 TAS5424C-Q1 |
Similar Part No. - TAS5424C-Q1_15 |
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Similar Description - TAS5424C-Q1_15 |
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