1

2

3

6

5

4

NO

GND

NC

COM

IN

TS5A3159

TS5A3159

www.ti.com

SCDS174C – AUGUST 2004 – REVISED MARCH 2015

5 Pin Configuration and Functions

DBV and DCK Packages

6-Pin SOT-23 and SC-70

(Top View)

Pin Functions

PIN

I/O

DESCRIPTION

NO.

NAME

1

NO

I/O

Digital control pin to select between NC and NO

2

GND

—

Ground

3

NC

I/O

Normally closed switch port

4

COM

I/O

Common switch port

5

V+

—

Power supply

6

IN

I

Switch select. High = COM connected to NO; Low = COM connected to NC.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.5

6.5

V

–0.5

V

Analog port diode current

±50

mA

ON-state switch current

±200

mA

±400

mA

–0.5

6.5

V

Digital input clamp current

–50

mA

±100

mA

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to ground, unless otherwise specified.

(3)

The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

(4)

This value is limited to 5.5 V maximum.

(5)

Pulse at 1-ms duration < 10% duty cycle.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

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