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TPS55340MRTETEP Datasheet(PDF) 4 Page - Texas Instruments |
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TPS55340MRTETEP Datasheet(HTML) 4 Page - Texas Instruments |
4 / 38 page TPS55340-EP SLVSCG7 – JULY 2014 www.ti.com 8 Specifications 8.1 Absolute Maximum Ratings (1) over operating temperature (unless otherwise noted) MIN MAX UNIT Supply voltages on pin VIN(2) –0.3 34 V Voltage on pin EN(2) –0.3 34 V Voltage on pins FB, FREQ, and COMP (2) –0.3 3 V Voltage on pin SS(2) –0.3 5 V Voltage on pin SYNC(2) –0.3 7 V Voltage on pin SW(2) –0.3 40 V Operating junction temperature –55 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground pin 8.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) –2000 2000 Electrostatic V(ESD) V discharge Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) –500 500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 8.3 Recommended Operating Conditions MIN NOM MAX UNIT VIN Input voltage 2.9 32 V VOUT Output voltage VIN 38 V VEN EN voltage 0 32 V VSYN External switching frequency logic input 0 5 V TA Operating free-air temperature –55 125 °C TJ Operating junction temperature –55 150 °C 8.4 Thermal Information TPS55340-EP THERMAL METRIC(1) UNIT WQFN (16 PINS) RθJA Junction-to-ambient thermal resistance 43.3 RθJC(top) Junction-to-case (top) thermal resistance 38.7 RθJB Junction-to-board thermal resistance 14.5 °C/W ψJT Junction-to-top characterization parameter 0.4 ψJB Junction-to-board characterization parameter 14.5 RθJC(bot) Junction-to-case (bottom) thermal resistance 3.5 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated |
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