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TPS61260 Datasheet(PDF) 4 Page - Texas Instruments

Part # TPS61260
Description  TPS6126x 0.8-V Input Synchronous Boost Converters with 100-mA Output Current
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TPS61260 Datasheet(HTML) 4 Page - Texas Instruments

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TPS61260, TPS61261
SLVSA99B – MAY 2011 – REVISED NOVEMBER 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VIN, L, VOUT, EN, FB
–0.3
5.0
V
Voltage range(2)
RI
–0.3
3.6
V
Operating junction temperature range, TJ
–40
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to network ground terminal.
6.2 Handling Ratings
MIN
MAX
UNIT
Tstg
Storage temperature range
–65
150
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
2
kV
pins(2)
VESD
Electrostatic discharge(1)
Charged device model (CDM), per JEDEC specification JESD22-
0.5
kV
C101, all pins(3)
(1)
ESD testing is performed according to the respective JESD22 JEDEC standard.
(2)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(3)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
Input supply voltage at VIN
0.8
4.0
V
Operating free air temperature range, TA
–40
85
°C
Operating junction temperature range, TJ
–40
125
°C
6.4 Thermal Information
TPS61260, TPS61261
THERMAL METRIC(1)
UNIT
DRV (6 PINS)
RθJA
Junction-to-ambient thermal resistance
89
RθJC(top)
Junction-to-case (top) thermal resistance
100
RθJB
Junction-to-board thermal resistance
35
°C/W
ψJT
Junction-to-top characterization parameter
2
ψJB
Junction-to-board characterization parameter
36
RθJC(bot)
Junction-to-case (bottom) thermal resistance
8
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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Copyright © 2011–2014, Texas Instruments Incorporated
Product Folder Links: TPS61260 TPS61261


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