ISL78302

3

FN7696.6

November 6, 2014

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Pin Configuration

ISL78302

(10 LD 3x3 DFN)

TOP VIEW

VIN

EN1

EN2

CBYP

CPOR

VO1

VO2

POR2

POR1

GND

2

3

4

1

5

9

8

7

10

6

Pin Descriptions

PIN

NUMBER

PIN

NAME

TYPE

DESCRIPTION

1

VIN

Analog I/O

Supply Voltage/LDO Input. Connect a 1µF capacitor to GND.

2

EN1

Low Voltage Compatible CMOS Input

LDO-1 Enable. ENABLE = HIGH

3

EN2

Low Voltage Compatible CMOS Input

LDO-2 Enable. ENABLE = HIGH

4

CBYP Analog I/O

Reference Bypass Capacitor Pin. Recommended to connect capacitor of value 0.01µF

between this pin and GND for optimum noise and PSRR performance.

5

CPOR Analog I/O

POR2 Delay Setting Capacitor Pin. Connect a capacitor between this pin and GND to delay

the POR2 output release after LDO-2 output reaches 94% of its specified voltage level.

(200ms delay per 0.01µF).

6

GND

Ground

GND is the connection to system ground. Connect to PCB Ground plane.

7POR1 Open-Drain Output (1mA)

Open-drain POR Output for LDO-1 (active-low). Internally connected to VO1 through 100kΩ

resistor.

8POR2 Open-Drain Output (1mA)

Open-drain POR Output for LDO-2 (active-low). Internally connected to VO2 through 100kΩ

resistor.

9VO2

Analog I/O

LDO-2 Output. Connect capacitor of value 1µF to 10µF to GND (1µF recommended).

10

VO1

Analog I/O

LDO-1 Output. Connect capacitor of value 1µF to 10µF to GND (1µF recommended).

Ordering Information

PART NUMBER

(Notes 1, 2, 3)

PART

MARKING

VO1 VOLTAGE

(V)

VO2 VOLTAGE

(V)

TEMP RANGE

(°C)

PACKAGE

(Pb-Free)

PKG

DWG. #

ISL78302ARFBZ

DNAB

2.5

1.5

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

ISL78302ARBFZ

DNAC

1.5

2.5

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

ISL78302ARNBZ

DNAD

3.3

1.5

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

ISL78302ARBNZ

DNAE

1.5

3.3

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

ISL78302ARNWZ

DNAF

3.3

1.2

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

ISL78302ARWCZ

DNAG

1.2

1.8

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

ISL78302ARFWZ

DNAH

2.5

1.2

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

ISL78302ARCWZ

DNAJ

1.8

1.2

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

ISL78302AR1AZ

DNAV

1.25

3.3

-40 to +105

10 Ld 3x3 DFN

L10.3x3C

NOTES:

1. Add “-T*”suffix for tape and reel. Please refer to TB347 for details on reel specifications.

2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte

tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil

Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

3. For Moisture Sensitivity Level (MSL), please see device information page for ISL78302. For more information on MSL please see techbrief TB363.