ISL78301

10

FN6705.2

April 7, 2015

Submit Document Feedback

Package Outline Drawing

M14.173B

14 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)

Rev 1, 1/10

BOTTOM VIEW

DETAIL "X"

TYPICAL RECOMMENDED LAND PATTERN

TOP VIEW

B

A

1

7

8

14

C

PLANE

SEATING

0.10 C

0.10 CBA

H

PIN #1

I.D. MARK

5.00 ±0.10

4.40 ±0.10

0.25 +0.05/-0.06

6.40

0.20 C B A

0.05

3.10 ±0.10

3.00 ±0.10

0°-8°

GAUGE

PLANE

SEE

0.90 +0.15/-0.10

0.60 ±0.15

0.15 +0.05/-0.06

5

2

3

1

3

1.00 REF

0.65

1.20 MAX

0.25

0.05 MIN

0.15 MAX

EXPOSED THERMAL PAD

SIDE VIEW

DETAIL "X"

END VIEW

1. Dimension does not include mold flash, protrusions or gate burrs.

Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.

2. Dimension does not include interlead flash or protrusion. Interlead

flash or protrusion shall not exceed 0.25 per side.

3. Dimensions are measured at datum plane H.

4. Dimensioning and tolerancing per ASME Y14.5M-1994.

5. Dimension does not include dambar protrusion.

Allowable protrusion shall be 0.80mm total in excess of dimension at

maximum material condition.

Minimum space between protrusion and adjacent lead is 0.07mm.

6. Dimension in ( ) are for reference only.

7. Conforms to JEDEC MO-153, variation ABT-1.

NOTES:

(1.45)

(5.65)

(0.65 TYP)

(0.35 TYP)

(3.10)

(3.00)