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TLV320AIC3107 Datasheet(PDF) 7 Page - Texas Instruments |
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TLV320AIC3107 Datasheet(HTML) 7 Page - Texas Instruments |
7 / 100 page TLV320AIC3107 www.ti.com SLOS545D – NOVEMBER 2008 – REVISED DECEMBER 2014 8.4 Thermal Information TLV320AIC3107 THERMAL METRIC(1) RSB YZF UNIT 40 PINS 42 PINS RθJA Junction-to-ambient thermal resistance 30.7 49.5 RθJC(top) Junction-to-case (top) thermal resistance 16 0.1 RθJB Junction-to-board thermal resistance 4.6 7.1 °C/W ψJT Junction-to-top characterization parameter 0.2 0.8 ψJB Junction-to-board characterization parameter 4.5 7 RθJC(bot) Junction-to-case (bottom) thermal resistance 0.9 n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 8.5 Dissipation Ratings (1) TA = 25°C DERATING TA = 75°C TA = 85°C PACKAGE TYPE POWER RATING FACTOR POWER RATING POWER RATING DSBGA(2) 1.60 W 20 mW/°C 600 mW 400 mW QFN 2.35 W 29.4 mW/° C 882 mW 588 mW (1) This data was taken using 2 oz. trace and copper pad that is soldered directly to a JEDEC standard 4-layer 3 in × 3 in PCB. (2) Product Preview Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: TLV320AIC3107 |
Similar Part No. - TLV320AIC3107_15 |
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