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MCP2510-IST Datasheet(PDF) 67 Page - Microchip Technology |
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MCP2510-IST Datasheet(HTML) 67 Page - Microchip Technology |
67 / 76 page ![]() 2000 Microchip Technology Inc. Preliminary DS21291C-page 67 MCP2510 Package Type: 18-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC) Foot Angle φ 04 80 4 8 15 12 0 15 12 0 β Mold Draft Angle Bottom 15 12 0 15 12 0 α Mold Draft Angle Top 0.51 0.42 0.36 .020 .017 .014 B Lead Width 0.30 0.27 0.23 .012 .011 .009 c Lead Thickness 1.27 0.84 0.41 .050 .033 .016 L Foot Length 0.74 0.50 0.25 .029 .020 .010 h Chamfer Distance 11.73 11.53 11.33 .462 .454 .446 D Overall Length 7.59 7.49 7.39 .299 .295 .291 E1 Molded Package Width 10.67 10.34 10.01 .420 .407 .394 E Overall Width 0.30 0.20 0.10 .012 .008 .004 A1 Standoff 2.39 2.31 2.24 .094 .091 .088 A2 Molded Package Thickness 2.64 2.50 2.36 .104 .099 .093 A Overall Height 1.27 .050 p Pitch 18 18 n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS INCHES* Units L β c φ h 45 ° 1 2 D p n B E1 E α A2 A1 A *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-013 Drawing No. C04-051 |
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