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LM341 Datasheet(PDF) 9 Page - Texas Instruments |
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LM341 Datasheet(HTML) 9 Page - Texas Instruments |
9 / 18 page LM341/LM78MXX www.ti.com SNVS090E – MAY 2004 – REVISED AUGUST 2005 Table 1. θJA Different Heatsink Area Layout Copper Area Thermal Resistance Top Sice (in2)(1) Bottom Side (in2) ( θJA, °C/W) TO-252 1 0.0123 0 103 2 0.066 0 87 3 0.3 0 60 4 0.53 0 54 5 0.76 0 52 6 1 0 47 7 0 0.2 84 8 0 0.4 70 9 0 0.6 63 10 0 0.8 57 11 0 1 57 12 0.066 0.066 89 13 0.175 0.175 72 14 0.284 0.284 61 15 0.392 0.392 55 16 0.5 0.5 53 (1) Tab of device attached to topside copper Figure 16. θJA vs. 2oz Copper Area for TO-252 Figure 17. Maximum Allowable Power Dissipation vs. Ambient Temperature for TO-252 Copyright © 2004–2005, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Links: LM341/LM78MXX |
Similar Part No. - LM341_15 |
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