X28HC256

2

FN8108.5

August 27, 2015

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Ordering Information

PART NUMBER

(Note 4)PART MARKING

ACCESS TIME

(ns)

TEMP. RANGE

(°C)

PACKAGE

PKG. DWG. #

X28HC256JZ-15 (Notes 1, 3)

X28HC256J-15 ZHY

150

0 to +70

32 Ld PLCC (RoHS Compliant)

N32.45x55

X28HC256JI-15 (Note 1)

X28HC256JI-15 HY

150

-40 to +85

32 Ld PLCC

N32.45x55

X28HC256JIZ-15

(Notes 1, 3)

X28HC256JI-15 ZHY

150

-40 to +85

32 Ld PLCC (RoHS Compliant)

N32.45x55

X28HC256PZ-15

(Notes 2, 3)

X28HC256P-15 HYZ

150

0 to +70

28 Ld PDIP (RoHS Compliant)

E28.6

X28HC256PIZ-15

(Notes 2, 3)

X28HC256PI-15 HYZ

150

-40 to +85

28 Ld PDIP (RoHS Compliant)

E28.6

X28HC256JZ-12 (Notes 1, 3)

X28HC256J-12 ZHY

120

0 to +70

32 Ld PLCC (RoHS Compliant)

N32.45x55

X28HC256JI-12 (Note 1)

X28HC256JI-12 HY

120

-40 to +85

32 Ld PLCC

N32.45x55

X28HC256JIZ-12

(Notes 1, 3)

X28HC256JI-12 ZHY

120

-40 to +85

32 Ld PLCC (RoHS Compliant)

N32.45x55

X28HC256PZ-12

(Notes 2, 3)

X28HC256P-12 HYZ

120

0 to +70

28 Ld PDIP (RoHS Compliant)

E28.6

X28HC256PIZ-12

(Notes 2, 3)

X28HC256PI-12 HYZ

120

-40 to +85

28 Ld PDIP (RoHS Compliant)

E28.6

X28HC256SZ-12 (Note 3)

X28HC256S-12 HYZ

120

0 to +70

28 Ld SOIC (300mils RoHS Compliant)

MDP0027

X28HC256SI-12

X28HC256SI-12 HY

120

-40 to +85

28 Ld SOIC (300mils)

M28.3

X28HC256SIZ-12 (Note 3)

X28HC256SI-12 HYZ

120

-40 to +85

28 Ld SOIC (300mils RoHS Compliant)

MDP0027

X28HC256JZ-90 (Notes 1, 3)

X28HC256J-90 ZHY

90

0 to +70

32 Ld PLCC (RoHS Compliant)

N32.45x55

X28HC256JI-90 (Note 1)

X28HC256JI-90 HY

90

-40 to +85

32 Ld PLCC

N32.45x55

X28HC256JIZ-90

(Notes 1, 3)

X28HC256JI-90 ZHY

90

-40 to +85

32 Ld PLCC (RoHS Compliant)

N32.45x55

X28HC256PZ-90

(Notes 2, 3)

X28HC256P-90 HYZ

90

0 to +70

28 Ld PDIP (RoHS Compliant)

E28.6

X28HC256PIZ-90 (Notes 2, 3) X28HC256PI-90 HYZ

90

-40 to +85

28 Ld PDIP (RoHS Compliant)

E28.6

X28HC256SI-90

X28HC256SI-90 HY

90

-40 to +85

28 Ld SOIC (300mils)

M28.3

X28HC256SIZ-90 (Note 3)

X28HC256SI-90 HYZ

90

-40 to +85

28 Ld SOIC (300mils RoHS Compliant)

MDP0027

NOTES:

1. Add “T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.

2. Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.

3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin

plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free

products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

4. For Moisture Sensitivity Level (MSL), please see product information page for X28HC256. For more information on MSL, please see tech brief TB363.