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LM25085 Datasheet(PDF) 4 Page - Texas Instruments |
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LM25085 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 34 page LM25085, LM25085-Q1 SNVS593J – OCTOBER 2008 – REVISED NOVEMBER 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings See (1) (2) MIN MAX UNIT VIN to GND -0.3 45 V ISEN to GND -3 VIN + 0.3 V ADJ to GND -0.3 VIN + 0.3 V RT, FB to GND -0.3 7 V VIN to VCC, VIN to PGATE -0.3 10 V (1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. 6.2 Handling Ratings - LM25085 MIN MAX UNIT Tstg Storage temperature range -65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all 2 kV pins(1) V(ESD) Electrostatic discharge Charged device model (CDM), per JEDEC specification 750 V JESD22-C101, all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Handling Ratings - LM25085-Q1 MIN MAX UNIT Tstg Storage temperature range -65 150 °C Human body model (HBM), per AEC Q100-002(1) 2 kV V(ESD) Electrostatic discharge Corner pins 1, 4, 5, 8 750 Charged device model (CDM), per V AEC Q100-011 Other pins 750 (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.4 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN Voltage 4.5 42 V Junction Temperature −40 125 °C 6.5 Thermal Information LM25085 LM25085 / LM25085 Q-1 THERMAL METRIC(1) VSSOP HVSSOP- WSON UNIT PowerPAD 8 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 153 54.1 44.8 RθJC Junction-to-case (top) thermal resistance 52.5 49.1 39.4 RθJB Junction-to-board thermal resistance 71.9 26.7 11.6 °C/W ψJT Junction-to-top characterization parameter 4.6 1.3 0.3 ψJB Junction-to-board characterization parameter 70.8 26.5 11.6 RθJC(bot) Junction-to-case (bottom) thermal resistance 29 3.6 5.0 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2008–2014, Texas Instruments Incorporated Product Folder Links: LM25085 LM25085-Q1 |
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