TPS3700

SBVS187D – FEBRUARY 2012 – REVISED JANUARY 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over operating temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

20

V

OUTA, OUTB

–0.3

20

V

INA+, INB–

–0.3

7

V

Current

Output terminal current

40

mA

–40

125

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to network ground terminal.

7.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-

±2500

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

1.8

18

V

Input voltage

INA+, INB–

0

6.5

V

Output voltage

OUTA, OUTB

0

18

V

7.4 Thermal Information

TPS3700

DDC (SOT)

DSE (WSON)

UNIT

6 PINS

6 PINS

Junction-to-ambient thermal resistance

204.6

194.9

Junction-to-case (top) thermal resistance

50.5

128.9

Junction-to-board thermal resistance

54.3

153.8

°C/W

Junction-to-top characterization parameter

0.8

11.9

Junction-to-board characterization parameter

52.8

157.4

Junction-to-case (bottom) thermal resistance

N/A

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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