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LM3673 Datasheet(PDF) 4 Page - Texas Instruments |
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LM3673 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 28 page LM3673 SNVS434L – JULY 2006 – REVISED OCTOBER 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings (1) (2) MIN MAX UNIT VIN pin: voltage to GND –0.2 6 V FB, SW, EN pins GND −0.2 (VIN + 0.2 V Continuous power dissipation(3) Internally Limited Junction temperature, TJ-MAX 125 °C Maximum lead temperature (soldering, 10 sec.) 260 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications. (3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ= 150°C (typical) and disengages at TJ= 130°C (typical). 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Machine model ±200 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN NOM MAX UNIT Input voltage(3) 2.7 5.5 V Recommended load current 0 350 mA Junction temperature, TJ –30 125 °C Ambient temperature, TA (4) –30 85 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to the potential at the GND pin. (3) The input voltage range recommended for ideal applications performance for the specified output voltages are as follows: VIN = 2.7 V to 4.5 V for 1.1 V ≤ VOUT < 1.5 V; VIN = 2.7 V to 5.5 V for 1.5 V ≤ VOUT < 1.8 V; VIN = (VOUT + VDROPOUT) to 5.5 V for 1.8 V ≤ VOUT ≤ 3.3 V where VDROPOUT = ILOAD × (RDSON, PFET + RINDUCTOR) (4) In applications where high power dissipation and/or poor package resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX), the maximum power dissipation of the device in the application (PD-MAX) and the junction to ambient thermal resistance of the package (RθJA) in the application, as given by the following equation:TA-MAX = TJ-MAX− (RθJA × PD-MAX). 7.4 Thermal Information LM3673 THERMAL METRIC(1) YZR (DSBGA) UNIT 5 PINS RθJA Junction-to-ambient thermal resistance(2) 181.0 °C/W RθJC(top) Junction-to-case (top) thermal resistance 0.9 °C/W RθJB Junction-to-board thermal resistance 110.3 °C/W ψJT Junction-to-top characterization parameter 7.4 °C/W ψJB Junction-to-board characterization parameter 110.3 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) Junction-to-ambient thermal resistance is highly application and board layout dependent. In applications where high power dissipation exists, special care must be given to thermal dissipation issues in board design. 4 Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: LM3673 |
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