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TLE42994GMV33 Datasheet(PDF) 28 Page - Infineon Technologies AG

Part # TLE42994GMV33
Description  Extreme Low Current Consumption In ON State
Download  33 Pages
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Manufacturer  INFINEON [Infineon Technologies AG]
Direct Link  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

TLE42994GMV33 Datasheet(HTML) 28 Page - Infineon Technologies AG

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Data Sheet
28
Rev. 1.1, 2014-07-03
TLE42994V33
Application Information
6.3
Thermal Considerations
Knowing the input voltage, the output voltage and the load profile of the application, the total power dissipation
can be calculated:
(4)
with
P
D: continuous power dissipation
V
I: input voltage
V
Q: output voltage
I
Q: output current
I
q: quiescent current
The maximum acceptable thermal resistance
R
thJA can then be calculated:
(5)
with
T
j,max: maximum allowed junction temperature
T
a: ambient temperature
Based on the above calculation the proper PCB type and the necessary heat sink area can be determined with
reference to the specification in “Thermal Resistance” on Page 11.
Example
Application conditions:
V
I = 13.5 V
V
Q = 3.3 V
I
Q = 50 mA
T
a = 105 °C
Calculation of
R
thJA,max:
P
D =(VI VQ) • IQ + VI Iq
= (13.5V – 3.3V) • 50mA + 13.5V • 2mA
= 0.510W + 0.027W
= 0.537W
R
thJA,max =(Tj,max Ta) / PD
= (150 °C – 105 °C) / 0.537 W
= 83.8 K/W
As a result, the PCB design must ensure a thermal resistance
R
thJA lower than 83.8 K/W. By considering
TLE42994E (PG-SSOP-14 EP package) and according to “Thermal Resistance” on Page 11, at least 300 mm²
heatsink area is needed on the FR4 1s0p PCB, or the FR4 2s2p board can be used.
PD
VI VQ
() I
Q
VI Iq
×
+
×
=
RthJA max
,
Tjmax
,
Ta
PD
----------------------------
=


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