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TLE42994GMV33 Datasheet(PDF) 11 Page - Infineon Technologies AG |
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TLE42994GMV33 Datasheet(HTML) 11 Page - Infineon Technologies AG |
11 / 33 page ![]() TLE42994V33 General Product Characteristics Data Sheet 11 Rev. 1.1, 2014-07-03 4.3 Thermal Resistance Table 3 Thermal Resistance Parameter Symbol Values Unit Note / Test Condition Number Min. Typ. Max. TLE42994GMV33 (PG-DSO-14) Junction to Soldering Point1) 1) not subject to production test, specified by design R thJSP – – 30 K/W measured to pin 5 P_4.3.1 Junction to Ambient1) R thJA – 63 – K/W FR4 2s2p board2) 2) Specified R thJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product (Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm³ board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu). Where applicable a thermal via array under the exposed pad contacted the first inner copper layer. P_4.3.2 Junction to Ambient1) R thJA – 112 – K/W FR4 1s0p board, footprint only3) 3) Specified R thJA value is according to JEDEC JESD 51-3 at natural convection on FR4 1s0p board; The Product (Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm3 board with 1 copper layer (1 x 70µm Cu). P_4.3.3 Junction to Ambient1) R thJA – 73 – K/W FR4 1s0p board, 300mm2 heatsink area on PCB3) P_4.3.4 Junction to Ambient1) R thJA – 65 – K/W FR4 1s0p board, 600mm2 heatsink area on PCB3) P_4.3.5 TLE42994EV33 (PG-SSOP-14 Exposed Pad) Junction to Soldering Point1) R thJSP – 10 – K/W measured to all GND pins P_4.3.6 Junction to Ambient1) R thJA – 47 – K/W FR4 2s2p board2) P_4.3.7 Junction to Ambient1) R thJA – 140 – K/W FR4 1s0p board, footprint only3) P_4.3.8 Junction to Ambient1) R thJA – 63 – K/W FR4 1s0p board, 300mm2 heatsink area on PCB3) P_4.3.9 Junction to Ambient1) R thJA – 53 – K/W FR4 1s0p board, 600mm2 heatsink area on PCB3) P_4.3.10 |
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