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TLE42994GMV33 Datasheet(PDF) 11 Page - Infineon Technologies AG

Part # TLE42994GMV33
Description  Extreme Low Current Consumption In ON State
Download  33 Pages
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Manufacturer  INFINEON [Infineon Technologies AG]
Direct Link  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

TLE42994GMV33 Datasheet(HTML) 11 Page - Infineon Technologies AG

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TLE42994V33
General Product Characteristics
Data Sheet
11
Rev. 1.1, 2014-07-03
4.3
Thermal Resistance
Table 3
Thermal Resistance
Parameter
Symbol
Values
Unit
Note / Test Condition
Number
Min.
Typ.
Max.
TLE42994GMV33 (PG-DSO-14)
Junction to Soldering Point1)
1) not subject to production test, specified by design
R
thJSP
30
K/W
measured to pin 5
P_4.3.1
Junction to Ambient1)
R
thJA
63
K/W
FR4 2s2p board2)
2) Specified
R
thJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm³ board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.
P_4.3.2
Junction to Ambient1)
R
thJA
112
K/W
FR4 1s0p board, footprint
only3)
3) Specified
R
thJA value is according to JEDEC JESD 51-3 at natural convection on FR4 1s0p board; The Product
(Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm3 board with 1 copper layer (1 x 70µm Cu).
P_4.3.3
Junction to Ambient1)
R
thJA
73
K/W
FR4 1s0p board, 300mm2
heatsink area on PCB3)
P_4.3.4
Junction to Ambient1)
R
thJA
65
K/W
FR4 1s0p board, 600mm2
heatsink area on PCB3)
P_4.3.5
TLE42994EV33 (PG-SSOP-14 Exposed Pad)
Junction to Soldering Point1)
R
thJSP
10
K/W
measured to all GND pins
P_4.3.6
Junction to Ambient1)
R
thJA
47
K/W
FR4 2s2p board2)
P_4.3.7
Junction to Ambient1)
R
thJA
140
K/W
FR4 1s0p board, footprint
only3)
P_4.3.8
Junction to Ambient1)
R
thJA
63
K/W
FR4 1s0p board, 300mm2
heatsink area on PCB3)
P_4.3.9
Junction to Ambient1)
R
thJA
53
K/W
FR4 1s0p board, 600mm2
heatsink area on PCB3)
P_4.3.10


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