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GP-HC3.0 Datasheet(PDF) 1 Page - List of Unclassifed Manufacturers |
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1 / 2 page Gap Pad® HC 3.0 is a soft and compliant gap filling material with a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly. Gap Pad® HC 3.0 maintains a conformable nature that allows for quick recovery and excellent wet-out characteristics, even to surfaces with high roughness and/or topography. Gap Pad® HC 3.0 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally- impeding adhesive layers. The top side has minimal tack for ease of handling. Gap Pad® HC 3.0 is supplied with protective liners on both sides. Note: To build a part number, visit our website at www.bergquistcompany.com. Gap Pad® HC 3.0 TYPICAL APPLICATIONS INCLUDE • Telecommunications • ASICs and DSPs • Consumer electronics • Thermal modules to heat sinks CONFIGURATIONS AVAILABLE • Sheet form and die-cut parts PDS_GP_HC 3_0415 FEATURES AND BENEFITS • Thermal Conductivity: 3.0 W/m-K • High-compliance, low compression stress • Fiberglass reinforced for shear and tear resistance PRODUCT DESCRIPTION High-Compliance, Thermally Conductive, Low Modulus Material April 2015 PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD Color Blue Blue Visual Reinforcement Carrier Fiberglass Fiberglass — Thickness (inch) / (mm) 0.020 to 0.125 0.508 to 3.175 ASTM D374 Inherent Surface Tack 2 2 — Density (Bulk Rubber) (g/cc) 3.1 3.1 ASTM D792 Heat Capacity (J/g-K) 1.0 1.0 ASTM E1269 Hardness (Bulk Rubber) (Shore 00) (4) 15 15 ASTM D2240 Young's Modulus (psi) / (kPa) (1) 16 110 ASTM D575 Typical UseTemp (°F) / (°C) -76 to 392 -60 to 200 — ELECTRICAL Dielectric BreakdownVoltage (Vac) (3) 5000 5000 ASTM D149 Dielectric Constant (1000 Hz) 6.5 6.5 ASTM D150 Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) (2) 3.0 3.0 ASTM D5470 THERMAL PERFORMANCE vs. STRAIN Deflection (% strain) 10 20 30 Thermal Impedance (°C-in2/W) 0.040" (2) 0.57 0.49 0.44 1) Young’s Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2 after 5 minutes of compression at 10% strain on a 1mm thickness material. 2) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. 3) Minimum value at 20 mil. 4) Thirty second delay value on Shore 00 hardness scale. TYPICAL PROPERTIES OF GAP PAD HC 3.0 .25 .50 .75 1.00 1.25 1.50 1.75 2.00 140 120 100 80 60 40 20 0 Thickness vs. Thermal Resistance Gap Pad HC 3.0 Thermal Resistance (C-in2/W) |
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