epoxy based, liquid-dispensable adhesive.

conductivity of 1.8 W/mK.

two-component format, and refrigeration is

not required.

strength with room temperature cure that

can be accelerated with additional heat.

The high bond strength eliminates the

need for fasteners and maintains structural

bond in severe environments.

Recommended usage is filling any surface

irregularities between heat sources and

heat spreaders of similar CTE.

remain in place during dispensing, and the

material will flow easily under minimal

pressure resulting in thin bondlines and

very low stress placed on fragile

components during assembly.

Note: To build a part number, visit our

website at www.bergquistcompany.com.

TYPICAL APPLICATIONS INCLUDE

• LED lighting

• Power supplies

• Discrete component to heat spreader

• Automotive lighting

• White goods

CONFIGURATIONS AVAILABLE

• Supplied in cartridge or kit form

PDS_LB_EA 1805_September 2014

FEATURES AND BENEFITS

• Room temperature cure

• Room temperature storage

• Thermal Conductivity: 1.8 W/m-K

• Eliminates need for mechanical fasteners

• Maintains structural bond in

severe-environment applications

• Excellent chemical and

mechanical stability

PRODUCT DESCRIPTION

Thermally Conductive, Two-Part,

Liquid Epoxy Adhesive

September 2014

PROPERTY

IMPERIAL VALUE

METRIC VALUE

TEST METHOD

Color / Part A

Gray

Gray

Visual

Color / Part B

Pale Yellow

Pale Yellow

Visual

Viscosity / Part A, High Shear (Pa-s) (1)

60

60

ASTM D2196

Viscosity / Part B, High Shear (Pa-s) (1)

62

62

ASTM D2196

Density (g/cc)

2.7

2.7

ASTM D792

Mix Ratio By Volume

1:1

1:1

—

Shelf Life @ 25°C (months)

6

6

—

PROPERTY AS CURED

Hardness (Shore D) (2)

90

90

ASTM D2240

Continuous Use Temp (°F) / (°C)

-40 to 257

-40 to 125

—

Shear Strength (psi) / (MPa) (3)

450

3.1

ASTM D1002

ELECTRICAL AS CURED

Dielectric Strength (V/mil) / (V/mm)

250

10,000

ASTM D149

Dielectric Constant (1000 Hz)

7.5

7.5

ASTM D150

Volume Resistivity (Ohm-meter)

ASTM D257

Flame Rating

V-O

V-O

U.L. 94

THERMAL AS CURED

Thermal Conductivity (W/m-K)

1.8

1.8

ASTM D5470

CURE SCHEDULE

Cure @ 25°C (hours)

10

10

—

Cure @ 125°C (min) (4)

10

10

—

1) Capillary Viscosity, 200/sec, Part A and B measured separately.

2) Thirty second delay value Shore D hardness scale.

3) Al to Al, cured at room temperature

4) 90% cure cycle - time after cure temperature is achieved at the interface. Ramp time is application dependent.

TYPICAL PROPERTIES OF LIQUI-BOND EA 1805