NCS12802

http://onsemi.com

5

unless otherwise specified

Symbol

Characteristics

Conditions

Min

Typ

Max

Unit

ANALOG

Reset Value

All outputs set to Code 0000h

0.015

0.12

V

Buffer Output Swing – High

OUT1 to OUT12 – Code 03FFh – Sourcing 10 mA

OUT1 to OUT12 – Code 03FFh – Sourcing 5 mA

14.7

14.8

14.9

V

Buffer Output Swing – Low

OUT1 to OUT12 – Code 0000h – Sinking 10 mA

OUT1 to OUT12 – Code 0000h – Sinking 5 mA

0.15

0.075

0.25

0.15

V

Continuous Output Current

Code 3FFh

30

mA

INL

Integral Non−linearity

0.3

LSB

DNL

Differential Non−linearity

0.3

LSB

DG

Gain Error

0.12

%

Load Regulation

0.5

mV/

mA

Program to Out Delay

2

ms

Tbksel

Bank Switching Delay

1

3.5

ms

Clock Frequency

(−40°C to +95°C)

Standard/Fast Mode

High Speed Mode

400

3.4

kHz

MHz

Low Level Input Voltage

SDA or SCL

0.3 x

DVDD

V

High Level Input Voltage

SDA or SCL

0.7 x

DVDD

V

Low Level Output Voltage

(Logic 0)

0.1

0.4

V

EEPROM Clock Speed

Master Mode

66

100

kHz

ANALOG POWER SUPPLY

Analog Supply Current

Outputs at Reset Values, No load

Over temperature from −40°C to 95°C

2.8

7

8

mA

PSRR

Power Supply Rejection

Ratio

−75

dB

DIGITAL POWER SUPPLY

Digital Supply Current

Outputs at Reset Values, No load, Two Wires Inactive

Over temperature from −40°C to 95°C

95

95

250

mA

DIGITAL VOLTAGE LEVELS

High Level Input Voltage

(Logic 1)

0.7 x

DVDD

V

Low Level Input Voltage

(Logic 0)

0.3 x

DVDD

V

Input Leakage Current

±0.01

±10

mA

POR

Power On Reset

1.1

1.5

1.7

V

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification

limit values are applied individually under normal operating conditions and not valid simultaneously.

7. Observe maximum power dissipation. Exposed thermal die is soldered to the PCB using thermal vias.