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TPS65263 Datasheet(PDF) 5 Page - Texas Instruments

Part # TPS65263
Description  TPS65263, 4.5- to 18-V Input Voltage, 3-A/2-A/2-A Output Current Triple Synchronous Step-Down Converter With I2C Controlled Dynamic Voltage Scaling
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TPS65263 Datasheet(HTML) 5 Page - Texas Instruments

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TPS65263
www.ti.com
SLVSCN0A – JUNE 2014 – REVISED SEPTEMBER 2014
8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature (unless otherwise noted)
(1)
MIN
MAX
UNIT
PVIN1, PVIN2, PVIN3,VIN
–0.3
20
LX1, LX2, LX3 (maximum withstand voltage transient <20 ns)
–1.0
20
BST1, BST2, BST3 referenced to LX1, LX2, LX3 pins respectively
–0.3
7
Voltage
V
EN1, EN2, EN3, V7V, VOUT1, VOUT2, VOUT3, SCL, SDA
–0.3
7
FB1, FB2, FB3, COMP1, COMP2, COMP3, SS1, SS2, SS3
–0.3
3.6
AGND, PGND1, PGND2, PGND3
–0.3
0.3
TJ
Operating junction temperature
–40
125
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
8.2 Handling Ratings
MIN
MAX
UNIT
Tstg
Storage temperature range
–55
150
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
–2000
2000
Electrostatic
V(ESD)
V
discharge
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)
–500
500
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
8.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
PVIN1, PVIN2, PVIN3,VIN
4.5
18
LX1, LX2, LX3 (Maximum withstand voltage transient <20 ns)
–0.8
18
Voltage
BST1, BST2, BST3 referenced to LX1, LX2, LX3 pins respectively
–0.1
6.8
V
EN1, EN2, EN3, V7V, VOUT1, VOUT2, VOUT3, SCL, SDA
–0.1
6.3
FB1, FB2, FB3, COMP1, COMP2, COMP3, SS1, SS2, SS3
–0.1
3
TA
Operating ambient temperature
–40
85
°C
TJ
Operating junction temperature
–40
125
°C
8.4 Thermal Information
TPS65263
THERMAL METRIC(1)
UNIT
RHB (32 PINS)
RθJA
Junction-to-ambient thermal resistance
33.3
RθJC(top)
Junction-to-case (top) thermal resistance
25.7
RθJB
Junction-to-board thermal resistance
7.4
°C/W
ψJT
Junction-to-top characterization parameter
0.3
ψJB
Junction-to-board characterization parameter
7.3
RθJC(bot)
Junction-to-case (bottom) thermal resistance
2.1
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2014, Texas Instruments Incorporated
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