Electronic Components Datasheet Search |
|
TPS65263 Datasheet(PDF) 5 Page - Texas Instruments |
|
TPS65263 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 46 page TPS65263 www.ti.com SLVSCN0A – JUNE 2014 – REVISED SEPTEMBER 2014 8 Specifications 8.1 Absolute Maximum Ratings over operating free-air temperature (unless otherwise noted) (1) MIN MAX UNIT PVIN1, PVIN2, PVIN3,VIN –0.3 20 LX1, LX2, LX3 (maximum withstand voltage transient <20 ns) –1.0 20 BST1, BST2, BST3 referenced to LX1, LX2, LX3 pins respectively –0.3 7 Voltage V EN1, EN2, EN3, V7V, VOUT1, VOUT2, VOUT3, SCL, SDA –0.3 7 FB1, FB2, FB3, COMP1, COMP2, COMP3, SS1, SS2, SS3 –0.3 3.6 AGND, PGND1, PGND2, PGND3 –0.3 0.3 TJ Operating junction temperature –40 125 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 8.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –55 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) –2000 2000 Electrostatic V(ESD) V discharge Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) –500 500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 8.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT PVIN1, PVIN2, PVIN3,VIN 4.5 18 LX1, LX2, LX3 (Maximum withstand voltage transient <20 ns) –0.8 18 Voltage BST1, BST2, BST3 referenced to LX1, LX2, LX3 pins respectively –0.1 6.8 V EN1, EN2, EN3, V7V, VOUT1, VOUT2, VOUT3, SCL, SDA –0.1 6.3 FB1, FB2, FB3, COMP1, COMP2, COMP3, SS1, SS2, SS3 –0.1 3 TA Operating ambient temperature –40 85 °C TJ Operating junction temperature –40 125 °C 8.4 Thermal Information TPS65263 THERMAL METRIC(1) UNIT RHB (32 PINS) RθJA Junction-to-ambient thermal resistance 33.3 RθJC(top) Junction-to-case (top) thermal resistance 25.7 RθJB Junction-to-board thermal resistance 7.4 °C/W ψJT Junction-to-top characterization parameter 0.3 ψJB Junction-to-board characterization parameter 7.3 RθJC(bot) Junction-to-case (bottom) thermal resistance 2.1 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TPS65263 |
Similar Part No. - TPS65263_15 |
|
Similar Description - TPS65263_15 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |