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TPS65279 Datasheet(PDF) 5 Page - Texas Instruments |
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TPS65279 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 38 page TPS65279 www.ti.com SLVSC85C – AUGUST 2013 – REVISED MAY 2015 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Voltage at VIN, PVIN1, PVIN2 –0.3 20 V Voltage at LX1, LX2 (maximum withstand voltage transient < 20 ns) –4.5 23 V Voltage at BST1, BST2, referenced to LX1, LX2 pin –0.3 7 V Voltage at V7V, EN1, EN2, RLIM1, RLIM2, PGOOD1, PGOOD2, MODE, –0.3 7 V ISHARE, ROSC Voltage at SS1, SS2, FB1, FB2, COMP1, COMP2 –0.3 3.6 V Voltage at AGND, PGND1, PGND2 –0.3 0.3 V TJ Operating virtual junction temperature –40 150 °C Tstg Storage temperature –55 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human body model (HBM) 2000 Electrostatic V(ESD) V discharge Charge device model (CDM) 1000 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN Supply input voltage range 4.5 18 V IOUT1, Load current 0 5 A IOUT2 Vout Output voltage 0.6 9 V EN Enable voltage 0 6 V TJ Operating junction temperature –40 125 °C 7.4 Thermal Information TPS65279 THERMAL METRIC(1) DAP (HTSSOP) RHH (VQFN) UNIT 32 PINS 36 PINS RθJA Junction-to-ambient thermal resistance 35 30.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 17.7 18.8 °C/W RθJB Junction-to-board thermal resistance 19 6 °C/W ψJT Junction-to-top characterization parameter 0.5 0.2 °C/W ψJB Junction-to-board characterization parameter 18.9 6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 1.3 0.7 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 2013–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TPS65279 |
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