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ABSOLUTE MAXIMUM RATINGS

DISSIPATION RATINGS

TPS70745, TPS70748

TPS70751, TPS70758

TPS70702

SLVS291D – MAY 2000 – REVISED DECEMBER 2007

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE-

SPECIFIED

LEAD

TEMPERATURE

ORDERING

TRANSPORT

PRODUCT

(DESIGNATOR)

NUMBER

MEDIA, QUANTITY

TPS70702PWP

Tube, 70

TPS70702

Adjustable

Adjustable

HTSSOP-24 (PWP)

-40

°C to +125°C

TPS70702PWPR

Tape and Reel, 2000

TPS70745PWP

Tube, 70

TPS70745

3.3 V

1.2 V

HTSSOP-24 (PWP)

-40

°C to +125°C

TPS70745PWPR

Tape and Reel, 2000

TPS70748PWP

Tube, 70

TPS70748

3.3 V

1.5 V

HTSSOP-24 (PWP)

-40

°C to +125°C

TPS70748PWPR

Tape and Reel, 2000

TPS70751PWP

Tube, 70

TPS70751

3.3 V

1.8 V

HTSSOP-24 (PWP)

-40

°C to +125°C

TPS70751PWPR

Tape and Reel, 2000

TPS70758PWP

Tube, 70

TPS70758

3.3 V

2.5 V

HTSSOP-24 (PWP)

-40

°C to +125°C

TPS70758PWPR

Tape and Reel, 2000

(1)

For the most current package and ordering information see the Package Option Addendum located at the end of this document, or see

the TI web site at www.ti.com.

(2)

For fixed 1.20V operation, tie FB to OUT.

Over operating free-air temperature range (unless otherwise noted)

(1)

TPS707xx

UNIT

(2)

–0.3 to +7

V

Voltage range at EN

–0.3 to +7

V

5.5

V

5.5

V

Maximum RESET, PG1 voltage

7

V

Maximum MR1, MR2, and SEQ voltage

V

Peak output current

Internally limited

Continuous total power dissipation

See Dissipation Ratings Table

–40 to +150

°C

–65 to +150

°C

ESD rating, HBM

2

kV

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are tied to network ground.

DERATING

PACKAGE

AIR FLOW (CFM)

FACTOR

0

3.067W

30.67mW/

°C

1.687W

1.227W

250

4.115W

41.15mW/

°C

2.265W

1.646W

(1)

This parameter is measured with the recommended copper heat sink pattern on a 4-layer PCB, 1 oz. copper on a 4-in by 4-in ground

layer. For more information, refer to TI technical brief SLMA002.

Copyright © 2000–2007, Texas Instruments Incorporated

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