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1N3826AUR-1TR Datasheet(PDF) 1 Page - Microsemi Corporation |
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1N3826AUR-1TR Datasheet(HTML) 1 Page - Microsemi Corporation |
1 / 3 page 1 Watt Metal Case Zener Diodes SCOTTSD A L E DIVISION 1N3821 thru 1N3830A DESCRIPTION APPEARANCE This well established zener diode series for the 1N3821 thru 1N3830A JEDEC registration in the glass hermetic sealed DO-13 package provides a low voltage selection for 3.3 to 7.5 volts. It is also well suited for high- reliability applications where it is available in JAN, JANTX, and JANTXV military qualifications. Higher voltages are also available in the 1N3016 thru 1N3051 series (6.8 V to 200 V) in the same package (see separate data sheet). Microsemi also offers numerous other Zener diode products for a variety of other packages including surface mount. DO-13 (DO-202AA) IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com FEATURES APPLICATIONS / BENEFITS • Zener Voltage Range: 3.3 V to 7.5 V • Hermetically sealed DO-13 metal package • Internally solder-bonded construction. • Also available in JAN, JANTX, JANTXV qualifications per MIL-PRF19500/115 by adding the JAN, JANTX, or JANTXV prefixes to part numbers for desired level of screening, e.g. JANTX1N3821, JANTXV1N3051A, etc. • Surface mount also available with 1N3821UR-1 thru 1N30330AUR-1 series on separate data sheet • Regulates voltage over a broad operating current and temperature range • Low voltage selection from 3.3 to 7.5 V • Tight voltage tolerances available • Low reverse (leakage) currents • Nonsensitive to ESD • Hermetically sealed metal package • Inherently radiation hard as described in Microsemi MicroNote 050 MAXIMUM RATINGS MECHANICAL AND PACKAGING • Operating Junction and Storage Temperatures: -65 oC to +175oC • THERMAL RESISTANCE: 50oC/W* junction to lead at 0.375 inches (10 mm) from body or 110 oC/W junction to ambient when leads are mounted on FR4 PC board with 4 mm 2 copper pads (1 oz) and track width 1 mm, length 25 mm • DC Power Dissipation *: 1 Watt at TL < +125oC 3/8” (10 mm) from body or 1.0 Watts at TL < +65 oC when mounted on FR4 PC board as described for thermal resistance above (also see Fig 1) • Forward Voltage @ 200 mA: 1.5 Volts. • Solder Temperatures: 260 o C for 10 s (maximum) • CASE: DO-13 (DO-202AA), welded, hermetically sealed metal and glass • FINISH: All external surfaces are Tin-Lead (Pb/Sn) plated and solderable per MIL-STD-750 method 2026 • POLARITY: Cathode connected case. • WEIGHT: 1.4 grams. • Tape & Reel option: Standard per EIA-296 (add “TR” suffix to part number) • See package dimensions on last page * For further mounting reference, thermal resistance from junction to metal case may be reduced to < 20 oC/W when mounting DO-13 metal case directly on heat sink. Microsemi Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503 Page 1 Copyright 2003 11-06-2003 REV A |
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