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NCP451AFCT2G Datasheet(PDF) 11 Page - ON Semiconductor |
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NCP451AFCT2G Datasheet(HTML) 11 Page - ON Semiconductor |
11 / 12 page NCP451 www.onsemi.com 11 PACKAGE DIMENSIONS WLCSP6, 1.40x0.90 CASE 567KB ISSUE A SEATING PLANE 0.25 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. 2X DIM A MIN NOM −−− MILLIMETERS A1 D E b 0.195 −−− e 0.50 BSC −−− D E A B PIN A1 REFERENCE e A 0.05 B C 0.03 C 0.05 C 6X b AB C 1 2 0.10 C A A1 A2 C 0.142 −−− 0.25 C 2X TOP VIEW SIDE VIEW BOTTOM VIEW NOTE 3 e A2 PITCH 0.25 6X DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 0.50 0.50 RECOMMENDED A1 PACKAGE OUTLINE PITCH e/2 −−− 0.320 −−− 1.400 −−− 0.900 0.235 0.510 0.172 0.338 1.440 0.940 MAX |
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